Broadcom Supplies Single-Chip Bluetooth(R) Solutions for Latest Family of Motorola Mobile Phones

Motorola's new models incorporate various Broadcom Blutonium(R) chips, including the BCM2035 and the BCM2033 high performance Bluetooth transceivers. Each of these single-chip solutions integrates both RF circuitry and digital baseband processing functions into a single all-CMOS integrated circuit, providing significant cost and power advantages over competing solutions. Broadcom's Blutonium solutions enable Bluetooth wireless connectivity in several new and recently introduced Motorola phones, including the V500, V600, A760, A830 and A835.

"Integration of Bluetooth in mobile phones is growing fast and Motorola's adoption of the technology is clearly helping to accelerate this trend," said Scott Bibaud, Director of Marketing for Broadcom's Bluetooth products. "Motorola's selection of Broadcom as a Bluetooth technology partner is an excellent endorsement of our technical advantages and manufacturing quality. With world-leading radio performance, low power consumption, and the flexibility to be customized to our partners' requirements, Broadcom's single-chip Bluetooth solutions are the perfect fit for highly-portable applications."

One of the first of Motorola's handsets using Broadcom's single-chip Bluetooth transceivers is the V600 multimode phone. This feature-rich GSM/GPRS/UMTS phone incorporates an MP3 player, digital camera and Bluetooth, among other features, to satisfy the connectivity and portable entertainment needs of the most demanding end users. The Motorola phones that feature Bluetooth technology include the V500, V600, A760, A830 and A835.

Broadcom's Bluetooth transceivers have been engineered specifically for the needs of highly portable devices like mobile phones. The radio performance and operation of these transceivers have been tailored to avoid cellular interference. In addition, through system integration Broadcom has achieved an industry leading footprint size, and has optimized the power consumption of these transceivers. Broadcom's single-chip solutions have also been designed to meet the aggressive price targets required by mobile phone OEMs.

Broadcom's Bluetooth solutions feature adaptable circuits that allow them to achieve strong performance even in highly challenging environments, such as inside mobile phones and laptop computers. In addition, the unique design of these chips allows them to maintain high performance even across the wide temperature ranges experienced by mobile phones.

The BCM2035 has been in volume production since early 2003 and the BCM2033 has been available since 2001.

About Broadcom

Broadcom Corporation is a leading provider of highly integrated silicon solutions that enable broadband communications and networking of voice, video and data services. Using proprietary technologies and advanced design methodologies, Broadcom designs, develops and supplies complete system-on-a-chip solutions and related hardware and software applications for every major broadband communications market. Our diverse product portfolio includes solutions for digital cable and satellite set-top boxes; cable and DSL modems and residential gateways; high-speed transmission and switching for local, metropolitan, wide area and storage networking; home and wireless networking; cellular and terrestrial wireless communications; Voice over Internet Protocol (VoIP) gateway and telephony systems; broadband network processors; and SystemI/O(TM) server solutions. These technologies and products support our core mission: Connecting everything(R).

Broadcom is headquartered in Irvine, Calif., and may be contacted at 1-949-450-8700 or at http://www.broadcom.com/.

Safe Harbor Statement under the Private Securities Litigation Reform Act of 1995:

All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward-looking statements. These forward-looking statements are based on our current expectations, estimates and projections about our industry, management's beliefs, and certain assumptions made by us, all of which are subject to change. Forward-looking statements can often be identified by words such as "anticipates," "expects," "intends," "plans," "predicts," "believes," "seeks," "estimates," "may," "will," "should," "would," "could," "potential," "continue," similar expressions, and variations or negatives of these words. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause our actual results to differ materially and adversely from those expressed in any forward-looking statement.

Important factors that may cause such a difference for Broadcom in connection with its BCM2033, BCM2035 and other Blutonium products include, but are not limited to, general economic and political conditions and specific conditions in the markets we address, including the continuing significant economic slowdown and volatility in the technology sector and semiconductor industry, trends in the broadband communications markets in various geographic regions, and possible disruption in commercial activities related to terrorist activity or armed conflict in the United States and other locations; the rate at which our present and future customers and end-users adopt Broadcom's technologies and products in the markets for high speed wireless networking applications; delays in the adoption and acceptance of industry standards in those markets; competitive pressures and other factors such as the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; our ability to retain and hire key executives, technical personnel and other employees in the numbers, with the capabilities, and at the compensation levels needed to implement our business and product plans; the availability and pricing of third party semiconductor foundry and assembly capacity and raw materials; fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; the risks of producing products with new suppliers and at new fabrication and assembly facilities; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the availability of our customers, to manage inventory; the loss of a key customer; our ability to specify, develop or acquire, complete, introduce, market and transition to volume production new products and technologies in a timely manner; the timing of customer-industry qualification and certification of our products and the risks of non-qualification or non-certification; the volume of our product sales and pricing concessions on volume sales; the effects of new and emerging technologies; changes in our product or customer mix; intellectual property disputes and customer indemnification claims and other types of litigation risk; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; the quality of our products and any remediation costs; the effectiveness of our expense and product cost control and reduction efforts; the risks and uncertainties associated with our international operations, particularly in light of recent events; the effects of natural disasters, public health emergencies, international conflicts and other events beyond our control; the level of orders received that can be shipped in a fiscal quarter; and other factors.

Our Annual Report on Form 10-K, subsequent Quarterly Reports on Form 10-Q, recent Current Reports on Form 8-K, and other Securities and Exchange Commission filings discuss the foregoing risks as well as other important risk factors that could contribute to such differences or otherwise affect our business, results of operations and financial condition. The forward-looking statements in this release speak only as of this date. We undertake no obligation to revise or update publicly any forward-looking statement for any reason.

Broadcom(R), the pulse logo, Connecting everything(R), and Blutonium(R) are trademarks of Broadcom Corporation and/or its affiliates in the United States and certain other countries. Bluetooth(R) is a trademark of the Bluetooth SIG. All other trademarks mentioned are the property of their respective owners.

   Broadcom Trade Press Contact
   Henry Rael
   Sr. Communications Specialist
   949-926-5734
   hrael@broadcom.com

   Broadcom Business Press Contact
   Bill Blanning
   Sr. Director, Corporate Communications
   949-926-5555
   blanning@broadcom.com

   Broadcom Technical Contact
   Scott Bibaud
   Marketing Director, Bluetooth
   949-926-5868
   sbibaud@broadcom.com

   Broadcom Investor Relations Contact
   T. Peter Andrew
   Sr. Director, Investor Relations
   949-926-5663
   andrewtp@broadcom.com

CONTACT: Trade Press, Henry Rael, Sr. Communications Specialist,
+1-949-926-5734, hrael@broadcom.com , or Business Press, Bill Blanning, Sr.
Director, Corporate Communications, +1-949-926-5555, blanning@broadcom.com ,
or Technical, Scott Bibaud, Marketing Director, Bluetooth, +1-949-926-5868,
sbibaud@broadcom.com , or Investor Relations, T. Peter Andrew, Sr. Director,
Investor Relations, +1-949-926-5663, andrewtp@broadcom.com , all of Broadcom
Corporation

Web site: http://www.broadcom.com/